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Fortified Aluminum Construction: Military-grade aluminum alloy with anodized finish delivers zero wobble
capable of withstanding temperatures up to 100°C
Power: USB Type-C (5V⎓1A)
It excels with PLA
BIQU PopCap for Snapmaker U1 – 120°C PC Enclosure, Noise-Reducing Top Cover for ABS, Nylon & PC Printing For Bambu Lab X1C Fortified Aluminum Construction: Military-grade aluminumThe BIQU PopCap is a clear, purpose built top cover for the Snapmaker U1, designed to complete your machine's thermal environment. It provides the U1 with essential 3D printer enclosure sealing and thermal stability for professional quality results. By maintaining a consistent chamber temperature, it effectively prevents warping, splitting, and shrinkagemaking it ideal for ABS, Nylon (PA), PC, and standard PLA filaments. Key Features Total Thermal
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