I/O Link Extender Module | Honeywell 51307106-175 Embedded CPU Baseplate • Communication Parameters: Baud Rate

• Communication Parameters: Baud Rate 110–115K

Output Channels: 2

Type: Control Module

Long description: DSMC 112 Floppy Disk Controller MA 215

I/O Link Extender Module | Honeywell 51307106-175 Embedded CPU Baseplate • Communication Parameters: Baud RateProduct Overview The Honeywell 51307106 175 is an industrial grade HPM I O link extender board that extends communication distance between the HPMM and remote I O files. Technical Specifications Compatibility: Honeywell TDC 3000, Experion PKS, HPMM Systems Interface Type: I O Link Interface Operating Temperature: 0C to +60C (32F to 140F) Storage Temperature: 40C to +85C ( 40F to 185F) Relative Humidity: 5% to 95% (Non condensing) Dimensions: Standard